News release

Date: 11th May 2011

Press-fit pins for solder-less assembly of power modules

Faster and easier assembly of power modules with press in technology

May 11th 2011 - Solder pins have been the interface of choice for power modules for many years. In this day and age, when cost saving very often leads to compromises in quality, Vincotech’s new Press-fit technology goes against the trend. The new Press-fit pin takes the assembly properties of Vincotech power modules a step further: the solder-less assembly of the modules, equally easy on both sides of the PCB, leads to higher reliability and design flexibility, and drastically reduces production costs.

The aim of the development was an interconnect technology that would eliminate the need for soldering of the power module, whilst maintaining the reliability standards and electrical capabilities of the solder pin. A further the target was, to realize the exact same layouts as those of the solder modules.
The Press-fit pin developed by Vincotech is highly reliable and electrically equal to the solder pin; this new press-in technology reduces assembly time and cost whilst increasing reliability. Added benefits are design flexibility, free choice of PCB thickness, and easy PCB repair and re-use.

For more information please see Vincotech’s article about Press-fit pins under:

About Vincotech:

Vincotech, an independent operating unit within Mitsubishi Electric Corporation, is a market leader in power modules in development and manufacturing of high-quality electronic power components for Motion Control, and Renewable Energy applications.
With some 500 employees worldwide, backed by vast experience and a long history in electronics integration, Vincotech leverages these assets to help customers attain maximum market success.
For more information please see:

Peter Sontheimer
Email: peter.sontheimer[at]vincotech[dot]com,
Tel.: +49 89 878067-0

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